規(guī)格：

高純錫：99.999% Sn-5N-I-15

檢測(cè)雜質(zhì)：Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg,Ni, Zn

雜質(zhì)總含量：≤10ppm

高純錫：99.9999% Sn-6N-I-16

檢測(cè)雜質(zhì)：Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni, Zn

雜質(zhì)總含量：≤1ppm

高純錫：99.99999% Sn-7N-I-17

檢測(cè)雜質(zhì)：Ag, Al, Au, Ca, Cu, Fe, Mg, Ni, Zn

雜質(zhì)總含量：≤0.1ppm

用途：主要用于制備化合物半導(dǎo)體、高純合金、超導(dǎo)材料、焊料以及化合物半導(dǎo)體的摻雜劑。

包裝：滌綸薄膜包裝后雙層復(fù)合膜真空封裝或直接玻璃管真空封裝。

Specification:

High purity Sn: 99.999% Sn-5N-I-15

Testingimpurity: Ag, Al, As, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Zn

Total impurity content: ≤10ppm

High purity Sn: 99.9999% Sn-6N-I-16

Testing impurity: Ag, Al, Au, Ca, Co, Cu, Fe, Mg,Ni, Zn

Total impurity content: ≤1ppm

High purity Sn: 99.99999% Sn-7N-I-17

Testing impurity: Ag, Al, Au, Ca, Cu, Fe, Mg,Ni, Zn

Total impurity content: ≤0.1ppm

Application: Tinis used in the manufacture of compound semiconductor, high purity alloy,superconducting material, solder and as a dopant of compound semiconductor.

Package: Packed with terylene film, and double poly-filmwith vacuum encapsulation. Packed with glass tube with vacuum encapsulationdirectly.